An Overview of the Com Express Type 10

An Overview of the Com Express Type 10

What Does Com Express Variant 10 Stand For?

The Type 10 Com Express unit is designed for insufficient power procedures (TDP 14W or less), like commercial, healthcare, transportation portable devices (smart batteries), and external controls.

The com express 10 Mini (84 x 55 mm, debit card size) can handle entry-level handling while consuming very little power. It also supports graphic designs and has a high I/O record for smartphone platforms.

Every module has the CPU and memory scores, as well as the PC/common AT’s I/O, USB, microphone, graphical (PEG), and Ethernet. All I/O connections are routed to two low-profile, high-density ports on the module’s lower surface.

A mezzanine-based technique is used by com express 10. The COM chips are often connected to a baseboard that is tailored to the task. Upgrades to newer, backward-compatible models of these intermediate modules can be made over time.

Commercial, armed services, aeronautical, entertainment, medical, public transit, Internet of Things, and basic computer integrated systems all employ Com Express.


According to the standard, there are eight different pin interceptions. Type 6 and Type 10 are perhaps the most often used pinouts.

Type 7 is the most recent pinout provided to the com express ten requirements in revision 3.0. COM Express 3.0 is suitable for data center, web server, and high-bandwidth appropriate monitoring because Type 7 supports up to four 10 GbE connections and up to 32 PCIe lanes.

Type 1, Type 2, Type 3, Type 4, and Type 5 were deprecated in COM Express Rev 3.0, with new designs being advised to use Type 6, 7, or 10.


There are four different form factors for com express 10:

  • 55 x 84 mm (2.2 x 3.3 in) Mini
  • 95 x 95 mm (3.7 x 3.7 in) compact
  • 95 mm x 125 mm (3.7 x 4.9 in)
  • 110 155 mm (4.3 6.1 in) extended


PICMG hosts the Com Express standards. It is not free; however, a hardcopy version can be acquired through the PICMG webpage for USD 150.

The first update, version 1.0, was launched on July 10, 2005. In March 2017, modification 3.0 (PICMG COM.0 R3.0) of Com Express was released. Com Express also designates an API to handle embedded capabilities like a control system or I2C. This is a separate document that is open to the public.

It also specifies a receiver board EEPROM for storing configuration data. This is a distinct and free-to-download document.


The COM Express concept is a free vintage standard. A customized carrier chip is used to create legacy connections or customized capabilities.

Thermostatic Design

Like Qseven and SMARC, the COM Express specification incorporates a heat spreader as a thermodynamic interface between both the COM Express unit and the platform’s conditioning solution. To prevent areas of high heat, all heat-generating elements are thermally transmitted to the field of activity.

Congatec’s proprietary high-efficiency flat heat pipes are used in the elevated units’ heat spreaders and cooling solutions to ensure optimal performance and dependability.